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[IEEE 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Shanghai, China (2005.6.27-2005.6.27)] 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - The 2004 International Electronics Manufacturing Initiative (iNEMI) Technology Roadmaps
Pfahl, R., McElroy, JamesYear:
2006
Language:
english
DOI:
10.1109/hdp.2005.251376
File:
PDF, 165 KB
english, 2006