[IEEE 2005 6th International Conference on Electronics...

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[IEEE 2005 6th International Conference on Electronics Packaging Technology - Shenzhen, China (30 Aug.-2 Sept. 2005)] 2005 6th International Conference on Electronic Packaging Technology - Micromachined Packaging for Ultrasonic Transducers with Particle Restraint Mechanisms

Hsing-Cheng Chang,, Chi-Chih Lai,, Hsien-Hui Tseng,, Yen-Ju Chen,
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Year:
2005
Language:
english
DOI:
10.1109/icept.2005.1564684
File:
PDF, 761 KB
english, 2005
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