Non-PR Sn-3.5Ag Bumping on a Fast Filled Cu-Plug by PPR...

IEEE Transactions on Components Packaging and Manufacturing Technology 2013 / 04 Vol. 3; Iss. 4

Non-PR Sn-3.5Ag Bumping on a Fast Filled Cu-Plug by PPR Current

Hong, Sung Chul, Jung, Do Hyun, Lee, Wang Gu, Kim, Wonjoong, Jung, Jae Pil
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Volume:
3
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2013.2240765
Date:
April, 2013
File:
PDF, 1.27 MB
english, 2013
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