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[IEEE Proceedings of 35th European Solid-State Device Research Conference, 2005. ESSDERC 2005. - Grenoble, France (12-16 Sept. 2005)] Proceedings of 35th European Solid-State Device Research Conference, 2005. ESSDERC 2005. - Interaction of middle-of-line (MOL) temperature and mechanical stress on 90nm hi-speed device performance and reliability
Lim, K.Y., Chan, V., Rengarajan, R., Lee, H.K., Rovedo, N., Lim, E.H., Yang, S., Jamin, F., Nguyen, P., Lin, W., Lai, C.W., Teh, Y.W., Lee, J., Kim, L., Luo, Z., Ng, H., Sudijono, J., Wann, C., Yang,Year:
2005
Language:
english
DOI:
10.1109/essder.2005.1546673
File:
PDF, 181 KB
english, 2005