Modeling and sensitivity analysis of circuit parameters for...

IEEE Transactions on Advanced Packaging 2005 / 02 Vol. 28; Iss. 1

Modeling and sensitivity analysis of circuit parameters for flip-chip interconnects using neural networks

Pratap, R.J., Staiculescu, D., Pinel, S., Laskar, J., May, G.S.
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Volume:
28
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2004.841772
Date:
February, 2005
File:
PDF, 1.04 MB
english, 2005
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