Fabrication of Silicon Carriers With TSV Electrical...

IEEE Transactions on Components and Packaging Technologies 2009 / 09 Vol. 32; Iss. 3

Fabrication of Silicon Carriers With TSV Electrical Interconnections and Embedded Thermal Solutions for High Power 3-D Packages

Aibin Yu,, Khan, N., Archit, G., Pinjala, D., Kok Chuan Toh,, Kripesh, V., Seung Wook Yoon,, Lau, J.H.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
32
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2009.2012719
Date:
September, 2009
File:
PDF, 3.06 MB
english, 2009
Conversion to is in progress
Conversion to is failed