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Fabrication of Silicon Carriers With TSV Electrical Interconnections and Embedded Thermal Solutions for High Power 3-D Packages
Aibin Yu,, Khan, N., Archit, G., Pinjala, D., Kok Chuan Toh,, Kripesh, V., Seung Wook Yoon,, Lau, J.H.Volume:
32
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2009.2012719
Date:
September, 2009
File:
PDF, 3.06 MB
english, 2009