An improvement of thermal conductivity of underfill materials for flip-chip packages
Li, H., Jacob, K.I., Wong, C.P.Volume:
26
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2003.811546
Date:
February, 2003
File:
PDF, 1.08 MB
english, 2003