![](/img/cover-not-exists.png)
[IEEE Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2008.10.22-2008.10.24)] 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference - Properties of a Newly Developed Immersion Tin Coating
Yau, Yung-Herng, Wang, Cai, Farrell, Robert, Ye, PingPing, Kudrak, Ed, Wengenroth, Karl, Abys, JosephYear:
2008
Language:
english
DOI:
10.1109/impact.2008.4783896
File:
PDF, 4.54 MB
english, 2008