[IEEE InterSociety Conference on Thermal Phenomena in...

  • Main
  • [IEEE InterSociety Conference on...

[IEEE InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V - Orlando, FL, USA (29 May-1 June 1996)] InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V - Combined pressure and subcooling effects on pool boiling from a PPGA chip package

Watwe, A.A., Bar-Cohen, A., McNeil, A.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
1996
Language:
english
DOI:
10.1109/itherm.1996.534574
File:
PDF, 933 KB
english, 1996
Conversion to is in progress
Conversion to is failed