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[IEEE InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V - Orlando, FL, USA (29 May-1 June 1996)] InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V - Combined pressure and subcooling effects on pool boiling from a PPGA chip package
Watwe, A.A., Bar-Cohen, A., McNeil, A.Year:
1996
Language:
english
DOI:
10.1109/itherm.1996.534574
File:
PDF, 933 KB
english, 1996