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[IEEE 2007 8th International Conference on Electronic Packaging Technology - Shanghai, China (2007.08.14-2007.08.17)] 2007 8th International Conference on Electronic Packaging Technology - Room Temperature Si/Si Wafer Direct Bonding in Air
Wang, Chenxi, Higurashi, Eiji, Suga, TadatomoYear:
2007
Language:
english
DOI:
10.1109/icept.2007.4441488
File:
PDF, 2.61 MB
english, 2007