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[IEEE 2005 6th International Conference on Electronics Packaging Technology - Shenzhen, China (30 Aug.-2 Sept. 2005)] 2005 6th International Conference on Electronic Packaging Technology - Development of fluxes for selected Sn-Cu based lead-free solders
Min Yang,, Xiuzhong Liu,, Chunqing Wang,, Zengda Zou,, Dalei Jiang,Year:
2005
Language:
english
DOI:
10.1109/icept.2005.1564733
File:
PDF, 291 KB
english, 2005