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[IEEE 52nd Electronic Components and Technology Conference - San Diego, CA, USA (28-31 May 2002)] 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) - A new flip chip packaging technology for the mid-range application space
Pendse, R.D., Kyung-Moon Kim,, Tam, S.Year:
2002
Language:
english
DOI:
10.1109/ECTC.2002.1008080
File:
PDF, 829 KB
english, 2002