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[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Stencil evaluation of ultra fine pitch solder paste printing process
Yang, Jimmy, Huang, Jay Cy, Lee, Vincent, Tsai, Jojo, Ku, J. L., Li, K. C., Hsieh, Ander, Chen, Cheng YuYear:
2010
Language:
english
DOI:
10.1109/impact.2010.5699642
File:
PDF, 217 KB
english, 2010