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[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Below 45nm low-k layer stress minimization guide for high-performance flip-chip packages with copper pillar bumping
Lee, Min Woo, Kim, Jin Young, Kim, Jae Dong, Lee, Choon HeungYear:
2010
Language:
english
DOI:
10.1109/ECTC.2010.5490766
File:
PDF, 1.76 MB
english, 2010