[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Developing underfill process in screening of no-flow underfill and wafer-applied underfill materials for 3D stacking
Rebibis, K. J., Capuz, G., Daily, R., Gerets, C., Duval, F., Teng, W., Struyf, H., Miller, R. A., Beyer, G., Beyne, E., Swinnen, B.Year:
2013
Language:
english
DOI:
10.1109/eptc.2013.6745697
File:
PDF, 1.86 MB
english, 2013