[IEEE 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) - Seattle, WA, USA (25-28 May 1998)] 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) - Thermal simulation and validation of the fast static RAM 164-lead FC-PBGA package with investigations of package thermal performance in a generic CPU module

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