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[IEEE 2005 6th International Conference on Electronics Packaging Technology - Shenzhen, China (30 Aug.-2 Sept. 2005)] 2005 6th International Conference on Electronic Packaging Technology - Improvements in Au wire bondability of rigid and flexible substrates using plasma cleaning
Yu Hin Chan,, Jang-Kyo Kim,, Deming Liu,, Peter Chou Kee Liu,, Yiu Ming Cheung,, Ming Wai Ng,Year:
2005
Language:
english
DOI:
10.1109/icept.2005.1564609
File:
PDF, 368 KB
english, 2005