[IEEE 2011 Materials for Advanced Metallization (MAM) - Dresden, Germany (2011.05.8-2011.05.12)] 2011 IEEE International Interconnect Technology Conference - Low damage etch approach for next generation Cu interconnect
Singh, Sunil. K., Lee, C. J., Tsai, C. H., Huang, T. M., Lu, C. W., Tsai, T. J., Chang, Y. S., Bao, T.I., Shue, S. L., Yu, C.H.Year:
2011
Language:
english
DOI:
10.1109/iitc.2011.5940313
File:
PDF, 165 KB
english, 2011