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[IEEE 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2014.7.15-2014.7.16)] 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Process development for 3D integration: Conductive wafer bonding for high density inter-chip interconnection
Chongshen Song,, Wenqi Zhang,, Dongkai Shangguan,Year:
2014
Language:
english
DOI:
10.1109/LTB-3D.2014.6886143
File:
PDF, 200 KB
english, 2014