Study of Flip Chip Solder Joint Cracks Under Temperature...

IEEE Transactions on Components and Packaging Technologies 2009 / 03 Vol. 32; Iss. 1

Study of Flip Chip Solder Joint Cracks Under Temperature Cycling Using a Laser Ultrasound Inspection System

Lizheng Zhang,, Ume, I.C., Gamalski, J., Galuschki, K.-P.
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Volume:
32
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2008.2007931
Date:
March, 2009
File:
PDF, 926 KB
english, 2009
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