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[IEEE 4th International Symposium on Electronic Materials and Packaging - Kaohsiung, Taiwan (4-6 Dec. 2002)] Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. - Application of neural networks and filtered back projection to wafer defect cluster identification
Chenn-Jung Huang,Year:
2002
Language:
english
DOI:
10.1109/emap.2002.1188820
File:
PDF, 420 KB
english, 2002