Simulations of Thermomechanical Stresses and Optical...

IEEE Transactions on Components and Packaging Technologies 2008 / 12 Vol. 31; Iss. 4

Simulations of Thermomechanical Stresses and Optical Misalignment in 1550-nm Transmitter Optoelectronic Modules Using FEM and Process Dispersions

Deshayes, Yannick, Bechou, Laurent, Verdier, F., Ousten, Yves, Laffitte, D., Goudard, J. L.
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Volume:
31
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2008.2001173
Date:
December, 2008
File:
PDF, 1.17 MB
english, 2008
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