[IEEE IEEE 43rd Electronic Components and Technology Conference (ECTC '93) - Orlando, FL, USA (1-4 June 1993)] Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) - Enhancement of TSOP solder joint reliability using encapsulation
Emerick, A., Ellerson, J., McCreary, J., Noreika, R., Woychik, C., Viswanadham, P.Year:
1993
Language:
english
DOI:
10.1109/ECTC.1993.346721
File:
PDF, 667 KB
english, 1993