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[IEEE 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, China (2013.07.15-2013.07.19)] Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Method to increase defect localization success rate on open failure by combining circuit layout analysis with photon emission microscopy
Lee Guan Siong,, Chin, Aaron, Chow Fong Ling,, Pee Kok Keng,Year:
2013
Language:
english
DOI:
10.1109/ipfa.2013.6599191
File:
PDF, 2.08 MB
english, 2013