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[IEEE 2006 IEEE International Reliability Physics Symposium Proceedings - San Jose, CA, USA (2006.03.26-2006.03.30)] 2006 IEEE International Reliability Physics Symposium Proceedings - Dielectric Conduction Mechanisms of Advanced Interconnects: Evidence for Thermally- Induced 3D /2 D Transition
Guedj, C., Claret, N., Arnal, V., Aimadeddine, M., Barnes, J.P., Barbe, J.C., Arnaud, L., Reimbold, G., Torres, J., Passemard, G., Boulanger, F.Year:
2006
Language:
english
DOI:
10.1109/relphy.2006.251269
File:
PDF, 843 KB
english, 2006