![](/img/cover-not-exists.png)
[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package
Zhang, Xiaowu, Chai, T.C., Lau, John H., Selvanayagam, C. S., Biswas, Kalyan, Shiguo Liu,, Pinjala, D., Tang, G.Y., Ong, Y.Y., Vempati, S.R., Wai, Eva, Li, H.Y., Liao, E.B., Ranganathan, N., Kripesh,Year:
2009
Language:
english
DOI:
10.1109/ECTC.2009.5074032
File:
PDF, 2.15 MB
english, 2009