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[IEEE 2006 International Conference on Electronic Materials and Packaging - Kowloon, China (2006.12.11-2006.12.14)] 2006 International Conference on Electronic Materials and Packaging - Finite Element Analysis of Dynamic Drop Impact of Board-level Stacked-Die Packages Using Submodeling Technique
Hsu, Hsiang-Chen, Hsu, Yu-Chia, Lee, Hui-Yu, Yeh, Chang-Lin, Lai, Yi-Shao, Fu, Shen-LiYear:
2006
Language:
english
DOI:
10.1109/EMAP.2006.4430622
File:
PDF, 2.02 MB
english, 2006