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[IEEE 2006 IEEE international SOI - Niagara Falls, NY, USA (2006.10.2-2006.10.5)] 2006 IEEE international SOI Conferencee Proceedings - High Temperature Oxygen Out-Diffusion from the Interfacial SiOx Bond Layer in Direct Silicon Bonded (DSB) Substrates
Sullivan, Jim, Kirk, Harry, Kang, Sien, Ong, Philip, Henley, FrancoisYear:
2006
Language:
english
DOI:
10.1109/soi.2006.284422
File:
PDF, 2.38 MB
english, 2006