[IEEE 2004 24th International Conference on Microelectronics - Nis, Serbia (16-19 May 2004)] 2004 24th International Conference on Microelectronics (IEEE Cat. No.04TH8716) - Hygro-thermal buckling of a thin PBGA package
Chi-Hui Chien,, Thaiping Chen,, Yii-Tay Chiou,, Chi-Chang Hsieh,, Yii-Der Wu,, Chung-Ting Wang,Volume:
2
Year:
2004
Language:
english
DOI:
10.1109/ICMEL.2004.1314909
File:
PDF, 240 KB
english, 2004