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[IEEE IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging - San Diego, CA, USA (25-27 Oct. 1999)] IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) - RF interconnect for multi-Gbit/sec board-level clock distribution
Woonghwan Ryu,, Hyungsoo Kim,, Seungyoung Ahn,, Namhoon Kim,, Baekkyu Choi,, Joungho Kim,Year:
1999
Language:
english
DOI:
10.1109/epep.1999.819188
File:
PDF, 379 KB
english, 1999