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Atmospheric pressure plasma cleaning of gold flip chip bump for ultrasonic flip chip bonding
Koo, J-M, Lee, J-B, Moon, Yj, Moon, W-C, Jung, S-BVolume:
100
Language:
english
Journal:
Journal of Physics: Conference Series
DOI:
10.1088/1742-6596/100/1/012034
Date:
March, 2008
File:
PDF, 464 KB
english, 2008