[IEEE 2012 IEEE 55th International Midwest Symposium on Circuits and Systems (MWSCAS) - Boise, ID, USA (2012.08.5-2012.08.8)] 2012 IEEE 55th International Midwest Symposium on Circuits and Systems (MWSCAS) - 3D profiling of thin film using contour analysis of interference fringe image and interpolation method

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