Reliability of Sn–Ag–Sb lead-free solder joints

Materials Science and Engineering: A 2005 Vol. 407; Iss. 1-2

Reliability of Sn–Ag–Sb lead-free solder joints

Hwa-Teng Lee, Heng-Sheng Lin, Cheng-Shyan Lee, Po-Wei Chen
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Volume:
407
Year:
2005
Language:
english
Pages:
9
DOI:
10.1016/j.msea.2005.07.049
File:
PDF, 768 KB
english, 2005
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