[IEEE 2005 7th Electronic Packaging Technology Conference - Singapore (07-09 Dec. 2005)] 2005 7th Electronic Packaging Technology Conference - High-G Drop Impact Response and Failure Analysis of a Chip Packaged Printed Circuit Board
Jenq, S.T., Sheu, H.S., Chang-Lin Yeh,, Yi-Shao Lai,, Jenq-Dah Wu,Volume:
2
Year:
2005
Language:
english
DOI:
10.1109/eptc.2005.1614478
File:
PDF, 4.13 MB
english, 2005