Influence of Intermetallic Properties on Reliability of...

IEEE Transactions on Advanced Packaging 2008 / 02 Vol. 31; Iss. 1

Influence of Intermetallic Properties on Reliability of Lead-Free Flip-Chip Solder Joints

Limaye, P., Vandevelde, B., Labie, R., Vandepitte, D., Verlinden, B.
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Volume:
31
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2007.909459
Date:
February, 2008
File:
PDF, 4.49 MB
english, 2008
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