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[IEEE 2013 IEEE 11th International New Circuits and Systems Conference (NEWCAS) - Paris, France (2013.06.16-2013.06.19)] 2013 IEEE 11th International New Circuits and Systems Conference (NEWCAS) - Benefits of three-dimensional circuit stacking for image sensors
Guezzi-Messaoud, Fadoua, Dupret, Antoine, Peizerat, Arnaud, Blanchard, YvesYear:
2013
Language:
english
DOI:
10.1109/newcas.2013.6573597
File:
PDF, 764 KB
english, 2013