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[IEEE High Density Design Packaging and Microsystem Integration, 2007 International Symposium on - (2007.06.26-2007.06.28)] High Density Design Packaging and Microsystem Integration, 2007 International Symposium on - Assessment on Reliability of BGA Package Double-Sided Assembled

Ye, Yuming, Liu, Sang, Tu, Yunhua, Chen, Limin, Zhang, Jian, Song, Zhiwei
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Year:
2007
Language:
english
DOI:
10.1109/hdp.2007.4283574
File:
PDF, 476 KB
english, 2007
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