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Composite Spreader for Cooling Computer Chip With Non-Uniform Heat Dissipation
El-Genk, M.S., Saber, H.H.Volume:
31
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/TCAPT.2008.916847
Date:
March, 2008
File:
PDF, 1.50 MB
english, 2008