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[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Encapsulated wafer level package technology (eWLCS)
Strothmann, Tom, Yoon, Seung Wook, Lin, YaojianYear:
2014
Language:
english
DOI:
10.1109/ectc.2014.6897399
File:
PDF, 697 KB
english, 2014