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[IEEE 2007 IEEE International Interconnect Technology Conferencee - Burlingame, CA, USA (2007.06.4-2007.06.6)] 2007 IEEE International Interconnect Technology Conferencee - Robust integration of an ULK SiOCH dielectric (k=2.3) for high performance 32nm node BEOL
Aimadeddine, M., Jousseaume, V., Arnal, V., Favennec, L., Farcy, A., Zenasni, A., Assous, M., Vilmay, M., Jullian, S., Maury, P., Delaye, V., Jourdan, N., Vanypre, T., Brun, P., Imbert, G., LeFriec, YYear:
2007
Language:
english
DOI:
10.1109/iitc.2007.382382
File:
PDF, 1.02 MB
english, 2007