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[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Low temperature processing of copper conductive ink for printed electronics applications
Salam, Budiman, Wai Lai Lai,, Lu Chee Wai Albert,, Lok Boon Keng,Year:
2011
Language:
english
DOI:
10.1109/eptc.2011.6184426
File:
PDF, 1.41 MB
english, 2011