Passivation cracking analysis of integrated-circuit microstructures under aeronautical conditions
Yuting He, Hongpeng Li, Hengxi Zhang, Feng Li, Chaohua FanVolume:
483-484
Year:
2008
Language:
english
Pages:
3
DOI:
10.1016/j.msea.2006.09.161
File:
PDF, 563 KB
english, 2008