Reliability investigations of hard core solder bumps using...

IEEE Transactions on Electronics Packaging Manufacturing 2002 / 07 Vol. 25; Iss. 3

Reliability investigations of hard core solder bumps using mechanical palladium bumps and SnPb solder

Oppermann, H., Kalicki, R., Anhoeck, S., Kallmayer, C., Klein, M., Aschenbrenner, R., Reichl, H.
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Volume:
25
Language:
english
Journal:
IEEE Transactions on Electronics Packaging Manufacturing
DOI:
10.1109/tepm.2002.806787
Date:
July, 2002
File:
PDF, 1.51 MB
english, 2002
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