Static Bending of Flip-Chip Structures Under Humid...

IEEE Transactions on Components Packaging and Manufacturing Technology 2013 / 07 Vol. 3; Iss. 7

Static Bending of Flip-Chip Structures Under Humid Conditions

Kokko, Kati, Saarinen, Kirsi, Mostofizadeh, Milad, Frisk, Laura
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
3
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2013.2243498
Date:
July, 2013
File:
PDF, 621 KB
english, 2013
Conversion to is in progress
Conversion to is failed