[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Temporary bonding for Chips In Wafer processing
Souriau, Jean-Charles, Jouve, Amandine, Sillon, NicolasYear:
2009
Language:
english
DOI:
10.1109/eptc.2009.5416513
File:
PDF, 710 KB
english, 2009