Thermal fatigue performance of Sn–Ag–Cu chip-scale package...

Materials Science and Engineering: A 2008 Vol. 483-484; Iss. none

Thermal fatigue performance of Sn–Ag–Cu chip-scale package with underfill

Bo-In Noh, Bo-Young Lee, Seung-Boo Jung
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Volume:
483-484
Year:
2008
Language:
english
Pages:
5
DOI:
10.1016/j.msea.2006.12.187
File:
PDF, 913 KB
english, 2008
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