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[IEEE 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2009.10.21-2009.10.23)] 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Failure analysis for electronic devices on flexible substrate
Shih-Ting Liu,, Tao-Chi Liu,, Ming-Lun Chang,, King-Ting Chiang,, Su-Ping Chiu,, Jandel Lin,, Po-Yuan Lo,, Pei-Wen Li,Year:
2009
Language:
english
DOI:
10.1109/impact.2009.5382200
File:
PDF, 1.24 MB
english, 2009