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Microcreep of rapidly solidified Sn–0.7 wt.% Cu–In solder alloys
Mustafa Kamal, Tarek El-AshramVolume:
456
Year:
2007
Language:
english
Pages:
4
DOI:
10.1016/j.msea.2007.01.056
File:
PDF, 356 KB
english, 2007