High electromagnetic shielding of plastic package for...

IEEE Transactions on Advanced Packaging 2005 / 02 Vol. 28; Iss. 1

High electromagnetic shielding of plastic package for 2.5-Gb/s optical transceiver modules

Tzong-Lin Wu,, Cheng-Wei Lin,, Wen-Chi Hung,, Chien-Hui Lee,, Wern-Shiarng Jou,, Wood-Hi Cheng,
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Volume:
28
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2004.841667
Date:
February, 2005
File:
PDF, 762 KB
english, 2005
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