[IEEE 2009 11th Electronics Packaging Technology Conference...

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[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Development and characterisation of high electrical performances TSV for 3D applications

Henry, D., Cheramy, S., Charbonnier, J., Chausse, P., Neyret, M., Garnier, G., Brunet-Manquat, C., Verrun, S., Sillon, N., Bonnot, L., Farcy, A., Cadix, L., Rousseau, M., Saugier, E.
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Year:
2009
Language:
english
DOI:
10.1109/EPTC.2009.5416490
File:
PDF, 1.43 MB
english, 2009
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